Wafer/Die Preparation Services

Backgrinding services

Beside backgrinding wafers for product those packaging in Millennium Microtech, customer also have an extended wafer backgrinding operation in our premise. This services is ideal for local customers who do not install wafer backgrinding machine.

Millennium Micrrotech provide wafer backgrind service for Si wafers diameter 4" - 8" with thinnest final thickness @ 8 Millinch.

Please contact us for more information and process detail.

Known Good Die & Die sales Services

" Known Good Die " is part of Millennium Microtech's long established reputation as hi-end / hi reliability Semiconductors packaging.

our "Known Good Die" process enable customer to test their die functional and reliability as " Packaged Die " condition, which means the die will undergo temperature test, burn-in, etc.. and will be reversed process to be back in " DIE " format .... so call " Known Good Die "

This services support our customers as part of die sales service that intended to serve extremely hi-reliability requirement such as Military/space level application.

For further information, please contact us at SathitTh@m-microtech.com