TQFP DATA SHEET

Process HighlightsBill of Material
Wafer Backgrind : CapableLeadframe : Copper, NiPdAu PPF
Die Thickness : Max 10 milDie Attach Epoxy : Silver filled Adhesive
Die Bond : Ink dot,MappingWire : Gold 99.99%
Wire Bond : 60/70 micron (Pad opening/Pad pitch)Mold Compound : MP8000 Series , GE1030S
Mark : LaserLead Finish : NiPdAu PPF, Pure Tin, SnPb
Lead finish : NiPdAu PPF, Pure TinPacking : Tray
Pack : Tray   
  
ReliablilityTest Service
MSL : J-STD-020, Level IMillennium Microtech provides a complete Turnkey solution, from
Auto Clave : JESD22-A102, 336 hrswafer backgrinding to final test and drop-ship. As an extension site,
Temperature Cycle : JESD22-A104, 1000 cyclesMillennium Microtech will reduce your cycle time and total cost of
   ownership.

Product Configurations

Lead CountBody SizeBody Thickness
(mil)		Standoff
(mil)		Lead Pitch
(mil)		Max. Die Size*
(mil)		Units/TrayMFG Site
4410 x 101.040.8245 x 245160Thailand
6410 x 101.040.5270 x 270160Thailand

*) Die size based on existing leadframe. Additional pad size can be made available.
This data sheet is for reference purpose only. For inquiries or official Millennium Microtech documentation, please contact your nearest
Millennium Microtech sales office.


CHINA OPERATIONTHAILAND OPERATIONUSA SALE OFFICE
------------------------------------------------------------------------------------------------------------------------------------------------
Mr. James Teh
Vice President, Business Development
E-mail: jamesteh@m-microtech.com
Tel: +86 (21) 5080-0210 Ext. 328
Fax: +86 (21) 5080-0133		 Mr. Sathit Thamutok
Director, Business Development
E-mail: SathitTh@m-microtech.com
Tel: +66 (38) 845-595
Fax: +66 (38) 845-597		 Mr. Keng Y Wong
Vice President, Sales
E-mail: kywong@m-microtech.com
Tel: (408) 855-1182
Cell phone: (408) 813-8482
 
Millennium Microtech Group 2005.