SOT23 DATA SHEET

Process HighlightsBill of Material
Wafer Backgrind : CapableLeadframe : Cu 194
Die Thickness : Max 10 milDie Attach Epoxy : 84-1LMISR4
Die Bond : Ink dot/Wafer mapWire : 1.0/1.3/2.0mil Au wire
Wire Bond : 70/100 micron (Pad size/Pad pitch)Mold Compound : MP80000CH4/EME6710SJ/EME-G600
Mark : LaserLead Finish : 85Sn:15Pb/Sn
Lead finish : 85Sn:15Pb/Sn   
Pack : Tape&Reel or Canister   
  
Test Service 
Millennium Microtech provides a complete Turnkey solution, from   
wafer backgrinding to final test and drop-ship. As an extension site,   
Millennium Microtech will reduce your cycle time and total cost of    
ownership.   

Product Configurations

Lead CountBody SizeBody Thickness
(mil)		Standoff
(mil)		Lead Pitch
(mil)		Max. Die Size*
(mil)		Units/TubeMFG Site
SOT23 3L2.95 x 1.350.980.013-0.1021.9052 x 28 China
SOT23 5L2.92 x 1.650.970.01-0.131.9054 x 38 China
SOT23 6L2.92 x 1.650.970.01-0.130.9573 x 38 China
SOT23 8L3.4 x 2.21.200.01-0.10.8069 x 36 China
SC59 3L2.95 x 1.650.970.01-0.131.9051 x 40 China

*) Die size based on existing leadframe. Additional pad size can be made available.
This data sheet is for reference purpose only. For inquiries or official Millennium Microtech documentation, please contact your nearest
Millennium Microtech sales office.


CHINA OPERATIONTHAILAND OPERATIONUSA SALE OFFICE
------------------------------------------------------------------------------------------------------------------------------------------------
Mr. James Teh
Vice President, Business Development
E-mail: jamesteh@m-microtech.com
Tel: +86 (21) 5080-0210 Ext. 328
Fax: +86 (21) 5080-0133		 Mr. Sathit Thamutok
Director, Business Development
E-mail: SathitTh@m-microtech.com
Tel: +66 (38) 845-595
Fax: +66 (38) 845-597		 Mr. Keng Y Wong
Vice President, Sales
E-mail: kywong@m-microtech.com
Tel: (408) 855-1182
Cell phone: (408) 813-8482
 
Millennium Microtech Group 2005.