PDIP DATA SHEET

Process HighlightsBill of Material
Wafer Backgrind : CapableLeadframe : Copper, NiPdAu PPF
Die Thickness : Max 29 mil(Thailand)Die Attach Epoxy : Silver filled Adhesive
  Max 25 mil(China)Wire : Gold 99.99%
Die Bond : Ink dot,MappingMold Compound : MP8000 Series , GE1030S
Wire Bond : 60/70 micron (Pad opening/Pad pitch)(Thailand)Lead Finish : NiPdAu PPF, Pure Tin, SnPb
  70/100 micron (Pad opening/Pad pitch)(China)Packing : Antistatic tube
Mark : Laser   
Lead finish : NiPdAu PPF, Pure Tin   
Pack : Tube   
  
ReliablilityTest Service
Auto Clave : JESD22-A102, 336 hrsMillennium Microtech provides a complete Turnkey solution, from
Temperature Cycle : JESD22-A104, 1000 cycles wafer backgrinding to final test and drop-ship. As an extension site,
   Millennium Microtech will reduce your cycle time and total cost of
   ownership.

Product Configurations

Lead CountBody SizeBody Thickness
(mil)
Standoff
(mil)
Lead Pitch
(mil)
Max. Die Size*
(mil)
Units/TubeMFG Site
8250 x 3701301510090 x 13055Thailand
8250 x 38013015100130 x 14050/60China
14250 x 75013015100100 x 13027Thailand
16250 x 75013015100130 x 20027Thailand
18256 x 90013015100130 x 17023Thailand
20256 x 103013015100140 x 20020Thailand
24256 x 117613015100140 x 18017Thailand
28 HEF288 x 138013015100176 x 29015Thailand
28 FEL269 x 137613015100140 x 30615Thailand
24 (600 mil)540 x 125016015100160 x 16016Thailand
28 (600 mil)510 x 140016015100200 x 20014Thailand/China
40 (600 mil)540 x 205216015100230 x 23610Thailand
48 (600 mil)540 x 245016015100200 x 2008Thailand

*) Die size based on existing leadframe. Additional pad size can be made available.
This data sheet is for reference purpose only. For inquiries or official Millennium Microtech documentation, please contact your nearest
Millennium Microtech sales office.


CHINA OPERATIONTHAILAND OPERATIONUSA SALE OFFICE
------------------------------------------------------------------------------------------------------------------------------------------------
Mr. James Teh
Vice President, Business Development
E-mail: jamesteh@m-microtech.com
Tel: +86 (21) 5080-0210 Ext. 328
Fax: +86 (21) 5080-0133
Mr. Sathit Thamutok
Director, Business Development
E-mail: SathitTh@m-microtech.com
Tel: +66 (38) 845-595
Fax: +66 (38) 845-597
Mr. Keng Y Wong
Vice President, Sales
E-mail: kywong@m-microtech.com
Tel: (408) 855-1182
Cell phone: (408) 813-8482
 
Millennium Microtech Group 2005.